Grooving Rib Cut - List of Manufacturers, Suppliers, Companies and Products

[Wafer Processing Contract Services] Laser Grooving and Rib Cutting, etc.

Numerous achievements: Various wafer processing options are available. From bare die shipment to package assembly, you can also choose the shipping method.

We offer various processing options, including laser grooving that allows for damage-free dicing of fragile chips such as low-k wafers. With many years of experience, we have numerous achievements! If you have any concerns, please feel free to consult us. - Back grinding - Laser grooving / dicing with blades - Wafer rib cutting TAIKO*1 - We can also handle bare die shipping and package assembly. - You can choose the shipping method as well. (Tray, dicing tape, embossed tape (reel) packaging, etc.) We can accommodate wafer diameters from 6 to 12 inches (rib cutting is only available for 8 inches).

• Company：エスタカヤ電子工業
• Price：Other

• Wafer